Fiber optic cables and UTP network cables connected to hub ports. [IMAGE: STMicroelectronics]
The rapid expansion of artificial intelligence (AI) and cloud computing is driving demand for high-speed, energy-efficient data transmission. Semiconductor manufacturer STMicroelectronics, Switzerland, recently announced its latest advancements in silicon photonics and bipolar CMOS (BiCMOS) technologies aiming to power next-generation data centers and AI clusters. The company says that these innovations will enable the development of high-performance optical interconnects with data rates of 800Gb/s and 1.6Tb/s while improving power efficiency.
Optical transceivers are at the heart of modern data centers, facilitating high-speed data exchange between servers, storage systems and networking equipment. STMicroelectronics’ silicon photonics technology integrates multiple optical and electronic components onto a single chip, enhancing performance while reducing power consumption, according to the company. Its BiCMOS technology further supports ultra-high-speed data transmission with minimal energy requirements.
In a press release, the firm confirmed its plans to mass produce these technologies at STMicroelectronics’ facility in Crolles, France. By manufacturing in Europe, it aims to provide a stable high-volume supply of semiconductor components for hyperscale data centers and optical module providers. This move aligns with broader industry efforts to localize chip production and mitigate supply chain disruptions.
Meeting the demands of AI
The increasing complexity of AI workloads is placing pressure on data center interconnects. Large-scale AI models process large datasets in real time, making the ability to transmit information quickly and reliably between computing nodes crucial. Chipmakers are turning to silicon photonics technology to keep up with demand.
STMicroelectronics’ silicon photonics and BiCMOS technologies are designed to improve energy efficiency and boost data throughput. “AI is accelerating the adoption of high-speed communication technology in data centers,” said Remi El-Ouazzane, president of STMicroelectronics’s Microcontrollers, Digital ICs, and RF Products Group. “Now is the right time for STMicroelectronics to introduce new power-efficient silicon photonics solutions and complement them with next-generation BiCMOS to support the evolution of optical interconnects.”
According to STMicroelectronics, it is collaborating with industry partners, such as Amazon Web Services (AWS), to refine its silicon photonics platform, PIC100. AWS is exploring leveraging STMicroelectronics’ technology to enhance interconnect performance for AI and cloud computing applications.
A look ahead
The market for silicon photonics–based optical transceivers is expected to grow significantly in the coming years. According to optical communications market consultancy LightCounting, the global market is projected to expand from US$7 billion in 2024 to over US$24 billion by 2030, with silicon photonics–based transceivers projected to account for 60% of the market by the end of the decade.
As demand for high-speed, energy-efficient interconnects continues to rise, silicon photonics is emerging as a key technology in the evolution of data centers. STMicroelectronics’ expansion into advanced optical interconnects reflects the growing industry shift toward integrating photonic and electronic components on a single silicon platform—an approach that could shape the next generation of high-performance computing and optical networking.