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References and Resources

R. Rupp et al. “Laser backside contact annealing of SiC power devices: A prerequisite for SiC thin wafer technology,” 2013 25th International Symposium on Power Semiconductor Devices & ICs (ISPSD), Kanazawa, Japan, pp. 51–54 (2013).

E. Kim et al. “4H-SiC wafer slicing by using femtosecond laser double-pulses,” Opt. Mater. Express 7, 2450 (2017).

B. Neuenschwander et al. “Laser Processing of GaN with Ultra-Short Pulses for Semiconductor Applications,” 40th International Congress on Applications of Lasers & Electro-Optics (ICALEO), paper MICRO 104 (2021).

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