Sony to Invest in Further CMOS Image Sensor Production

10 April, 2015—Sony Corporation (Tokyo) announced this week plans to increase production capacity for stacked complementary metal–oxide–semiconductor (CMOS) image sensors for an anticipated increase in the market for mobile devices, smartphones and tablets. The company plans to invest 45 billion yen (US$370 million) in Sony Semiconductor Corporation to increase capacity from 60,000 wafers per month to 87,000 wafers per month by the end of September 2016. 

In February, Sony announced plans to invest 105 billion yen to increase production to 80,000 wafers per month by the end of June 2016 at its Technology Centers in Nagasaki, Yamagata and Kumamoto. This week’s announcement adds to that total, and will primarily augment production facilities used in creating masters, layering and downstream processes for stacked CMOS sensors at the Nagasaki and Yamagata Technology Centers. Sony’s investment will solidify its leadership position in the image sensor market.